TA Team Tata Electronics

Job Description

About The Business

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU), and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications, and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.'

Responsibilities

The Owner Tool Hookup Design Manager is the strategic technical lead responsible for the end-to-end engineering of connecting semiconductor manufacturing equipment to the facility's infrastructure. This role acts as the primary integrator between internal Module Engineers, IE Team, the Facility Team, and external General Contractor or A&E Design Firm. You are tasked with establishing site-specific design governance and translating Technology Transfer data into buildable, localized Tool Hookup Construction packages. By reconciling Transfer information and Vendor specifications with facility Points of Connection and system capacities, you ensure the factory is "Ready for Equipment" on schedule and within scope. In this role you will report to the Design Manager, and matrix managed via the Site Tool Hookup Manager.

Key Responsibilities

• Site Design Governance: Establish and document the Project Design Review Schedule, Processes, Systems and Procedures for the new site, including defining 30/60/90% review milestones, technical audit workflows, and the formal approval matrix for all Tool Hookup Construction Issued packages. Includes software systems and databases.
• Technology Transfer Management: Lead the validation of reference design data from the Technology Transfer Site and collaborate with Owner Module Engineers and the External A&E to validate that process-specific requirements are accurately localized for the new facility. Development of Master Design Packages per Tool Type and a Site Installation Detail workbook for the Project.
• Facility & Base-Build Alignment: Partner with the Facility Design Team to ensure the Base-Build infrastructure provides sufficient Points of Connection (POCs) and system capacity to meet the aggregated demand of the Module toolsets. Cross reference transfer site specifications with Facilities Specifications, reconcile differences and issue aligned Site Specifications for Tool Hookup.
• GC/A&E Firm Oversight: Function as the primary Owner representative to manage the external GC/A&E firm. Audit their engineering deliverables for quality, ensuring they translate and reconcile data into individual site-specific Tool Hookup Designs that adhere to local codes, project specifications, and meet the overall Project Schedule.
• Vendor Specification Management: Interface between Tool Vendors (OEMs), Module Engineers, and the GC (General contractor) to capture the latest equipment utility requirements, ensuring designs reflect the most current information.
• System Capacity & POC Cross-Checking: Perform rigorous Utility Load-to-Capacity analysis, cross-checking the facility supplies against the Module demand to identify and resolve capacity gaps before tool move-in.
• BIM & Spatial Coordination: Direct the 3D BIM coordination process to ensure clash-free utility routing and optimized spatial allocation for tools, maintenance access, and future expansion.
• Change Control Leadership: Establish and lead the Tool Hookup Design Change Control Board to manage project scope and approved changes to the reference site.

Success Metrics

• Schedule Performance: 100% on-time delivery of Design Packages against the Master Project Schedule to ensure zero delays to "Ready for Equipment" (RFE) dates.
• Scope Control: Minimization of "Scope Creep" through strict adherence to the localized technology transfer baseline and formal justification of all deviations via the CCB process.
• Design Quality & Compliance: Ensuring alignment with Technology Transfer Site standards while achieving 100% compliance with local building codes, EHS regulations, resulting in minimal field rework or RFIs.
• Process Maturity: Successful implementation and 100% stakeholder adoption of the Site Design Review SOPs.

Essential Attributes

Qualifications

Education: Bachelor’s or Master’s degree in Mechanical, Electrical, or Chemical Engineering.

Desired Experience Level

• Experience: 5+ years in Semiconductor Tool Hookup Design or Installation on fast-track projects. A proven history of managing external EPC partners and Technology Transfers in Greenfield or Brownfield environments. Leadership of Design Teams during this period is an advantage.
• Technical Proficiency: Expertise in Utility Modelling, P&ID/SLD interpretation, and high proficiency in BIM/Navisworks for multi-discipline coordination.
• Problem Solving: Experience in the use of formal problem-solving techniques and managing ambiguous data sources.
• Soft Skills: Advanced stakeholder management with the ability to navigate between the requirements of Module Engineers and any constraints of the Facility Design. Advanced presentation skills for Status Report out to Senior Management.

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